Techies:
     
     Our engineering department wishes to use a MELF package (National 
     Semiconductor LL-34) for a diode on a new design. They intend to mount 
     this part on the bottom side of the PCB. Last I heard, this type of 
     package caused major headaches and extra cost during assembly. Has 
     anyone out there used this package in high-volume production? What are 
     the known pitfalls today? What percentage increase in assembly cost 
     can we expect (if any)? What footprint works the best (SM-782 has 2 
     recommendations, one has notched pads to help keep the part from 
     rolling)? Any other gotchas we should be aware of? 
     
     Thank you in advance for your help - Alexis Meehan - ATI

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