I agree with .025" for a distance to wave soldered pads.

To reflowed pads the minimum distance should be the minimum distance to
ensure a soldermask dam (.010 to .015).
_______________________________________________________________________________
Subject: Re: via holes & surface mount components
From:    [log in to unmask] at Internet
Date:    2/13/96  2:00 PM

     Via hole should be atleast .025 away from surface mount pads.


______________________________ Reply Separator _________________________________
Subject: via holes & surface mount components
Author:  [log in to unmask] at corp
Date:    2/12/96 4:10 PM


What is the minimum distance via holes can be to surface mount components?
     


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Subject: Re: via holes & surface mount components
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