TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Bruce Smith" <[log in to unmask]>
Date:
Tue, 01 Oct 96 11:01:19 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (87 lines)
     To:
     
     Bill Kasprzak
     Moog Inc.
     
     A few years ago we used a "saddle", made from a plastic channel we obtained 
     from Richco Plastic in Chicago.  The plastic was Dupont FE2400 and the 
     latest phone number I have for Richco Plastic is (312) 539-4060.  Neither 
     the saddle or the "V" standoff quite makes .060"; they are more like 
     .035"-.040".
     
     Bruce Smith
     [log in to unmask]
     Smiths Industries
     Grand Rapids, MI
     (616) 241-8379


______________________________ Forward Header __________________________________
Subject: Soldering CK06 Capacitors
Author:  [log in to unmask] at SMTPpost 
Date:    9/30/96 3:26 PM



We are currently working a job that uses NASA spec NHB5300.4(3A-2) as a 
guide for Requirements for Soldered Electrical Connections.
Does anyone have any tricks for supporting the body of CK06 style leaded 
components which are mounted radially that needs to be supported approx. 
.060" up off the board ???  The "S" level component is not available with 
the "V" standoff on the body.

Thanks

Bill Kasprzak
Moog Inc.
716-652-2000 ext. 2507

*************************************************************************** 
* TechNet mail list is provided as a service by IPC using SmartList v3.05 * 
*************************************************************************** 
* To unsubscribe from this list at any time, send a message to:           * 
* [log in to unmask] with <subject: unsubscribe> and no text.        * 
***************************************************************************


Received: from esseye.si.com by smtpgwy.si.com (SMTPLINK V2.11)
    ; Mon, 30 Sep 96 15:26:13 EST
Return-Path: <[log in to unmask]>
Received: by esseye.si.com
    via rmail with stdio
    id <[log in to unmask]>
    for [log in to unmask]; Mon, 30 Sep 1996 15:18:11 -0400 (EDT)
    (Smail-3.2 1996-Jul-4 #4 built 1996-Aug-27)
Received: from simon.ipc.org by relay4.UU.NET with SMTP 
    (peer crosschecked as: IPC.ORG [168.113.24.64])
    id QQbjlc05003; Mon, 30 Sep 1996 15:10:11 -0400 (EDT)
Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI)
     id NAA15964; Mon, 30 Sep 1996 13:50:22 -0700
Resent-Date: Mon, 30 Sep 1996 13:50:22 -0700
Received: by ipc.org (Smail3.1.28.1 #2)
    id m0v7mHy-0000TLC; Mon, 30 Sep 96 12:37 CDT
Resent-Sender: [log in to unmask]
Old-Return-Path: <[log in to unmask]>
From: "Kasprzak, Bill        (esd) US" <[log in to unmask]>
To: IPC-Tech Net <[log in to unmask]>
Subject: Soldering CK06 Capacitors
Date: Mon, 30 Sep 96 13:46:00 PDT
Message-Id: <[log in to unmask]>
Encoding: 13 TEXT
X-Mailer: Microsoft Mail V3.0
Resent-Message-ID: <"z4urq3.0.S1K.bL0Ko"@ipc>
Resent-From: [log in to unmask]
X-Mailing-List: <[log in to unmask]> archive/latest/6568
X-Loop: [log in to unmask]
Precedence: list
Resent-Sender: [log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2