Bob, I feel that this reply (given twice) posted on TechNet is too
commercial and violates the "no-advertising" intent of the email forum.
I feel that this message is more appropriate for sending to interested
individuals instead of the entire forum. Certainly when someone asks
"Who has X" and someone replies "I do" is an appropriate application of
the forum. But the extent of detail and the pricing etc. is too much. I
would suggest sticking to the "I do and can provide further details to
interested individuals" type of response in the future.
Thanks for your cooperation.
Dave
__________________________________________________
David W. Bergman, Technical Director
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
847-509-9700 x340 Phone
847-509-9798 Fax
email [log in to unmask]
www http://www.ipc.org
faxback support 800-646-0089
---------------------------------------------------
On 6 Jun 1996, Bob Willis wrote:
> Thanks for the mail. The cost of each disk will be L99 + VAT in Europe. Payment
> may be made by a sterling cheque provided it is from a UK bank based in the UK
> Credit Card transaction may also be arranged.
>
> The disk will be available at the end of the month the defect albums are
> available now.
>
> New Conventional Assembly Defects Photo Album
>
> This CD ROM provides the process or quality engineer with a source of
> photographs of process defects which may be used in company inspection
> documents, training material or presentations. They may be simply pasted into
> any document for in house company use. Each photograph is provided as a .Tiff
> file format.
>
> The disk includes examples of the following:
>
> Component lifting, Component damage, Contamination, Pin Holes, Blow Holes, PCB
> Microsections, Solder Spikes, Poor Solder Penetration, Poor Fluxing,
> Delamination, Sunken Joints, Cracked Joints, Lifted Pads, Poor Through Hole
> Plating, Resist Lifting, Legend Ink Contamination, Solder Balls, lead Damage,
> Corrosion, Voiding, Damaged Components, Non Wetting, De Wetting, Dendrite
> Growth, Microsections of good through plating and poor plating, Contamination in
> through holes, Resist in through holes etc.
>
>
> Bob Willis Surface Mount Process Defect Guide
>
> The first CD ROM provides a guide to common process defects found at each stage
> of the SMT process. It also includes defects specifically on printed boards and
> components. At the first screen you select the process you want to view which
> gives you an introduction to the processes listed below.
>
> Printed Boards, Components inc; BGA, Screen Print, Adhesive Application,
> Placement, Reflow Solder, Wave Solder, Cleaning, Rework
>
> In the case of printed board section it explains the most important issues with
> surface mount circuits. It then lists common process defects which can be
> selected to reveal a photographic example of the defect type and an explanation
> of the possible causes.
>
> This disk will form part of the forthcoming Bob Willis Master Class Series
>
>
> Surface Mount Process Defects Photo Album
>
> This CD ROM provides the process or quality engineer with a source of
> photographs of process defects which may be used in company inspection document
> or presentations. They may be simply pasted into any document for in house
> company use. Each photograph is provided as a .Tiff file format.
>
> The disk includes examples of the following:
>
> Chip Leaching, Poor Solderability, Plastic Cracking, BGA Misplacement, BGA
> Cracking, BGA Cracking, Capacitor Cracking, Plastic Softening, QFP Cracking,
> Solder Beading, Crystallised Joints, Cracked Joint, Poor Pad Wetting, Component
> Lift, No Wetting, Joint Failure, Joint Voiding, Solder Wicking, Component
> Lifting, Solder Short, Non Reflow, PCB Measeling, Poor Penetration, Solder
> Skip, Bulbous Joint, Blow Hole, Solder Webbing, Adhesive Contamination,
> Adhesive Stringing, Excess Adhesive, Misplaced Lead, Misplaced Component,
> Dendrite Growth, Corrosion, Solder Spikes, Flux Residues, Joint Cracking,
> Pad Lifting etc
>
>
> Surface Mount Inspection Standards
>
> The CD ROM provides a simple tutorial on inspection of surface mount assemblies.
> It covers adhesive application, placement and soldering. The four main
> termination's are covered, chip, gull wing, J Lead and castillation. The
> criteria is given with each example which is in line with the current European
> and IPC standards.
>
> A test section is include which allows staff to asses there understanding of the
> standard against actual solder joints examples. This provides assessment against
> the basic criteria in the standard.
>
> Also included on the CD ROM is an inspection standard which can be modified or
> printed out with illustrations for a company training document or inspection
> standard.
>
>
> Conventional Soldering Standards
>
> The CD ROM provides a simple tutorial on inspection of conventional assemblies.
> It covers lead length, lead clench and soldering of components and wire
> termination's. Single sided, double sided boards are illustrated. The criteria
> is given for each example which is in line with the current European and IPC
> standards.
>
> A test section is include which allows staff to asses there understanding of the
> standard against actual solder joints examples. This provides assessment against
> the basic criteria in the standard.
>
> Also included on the CD ROM is a inspection standard which can be modified or
> printed out with illustrations for a company training document or inspection
> standard.
>
>
> Bob Willis
> Electronic Presentation Services
> 2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
> Tel: (44) 01245 351502
> Fax: (44) 01245 496123
> Home Page: http://ourworld.compuserve.com/homepages/bwillis
> Email: [log in to unmask]
>
>
>
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