We are trying to do SPC on our wave soldering process.  It seems that
everyone in our company has their own opinion as to what should be tracked.

I would like to hear from anyone who is successfully, (or unsuccessfully),
using SPC on their wave solder process and what it is that you are
measuring.  Some suggestions from our SPC group are as follows:

Prevention:  What do others "look at" and why?  Solder density, wave height,
various temperatures, angles, rates, etc.  How much impact does board
configuration have?  Tightly packed and complex or loose and simple? 

Failure:  What is a good measure of defects?  Defects per solder joint, per
hole, top and bottom, per board, per square inch, per component, per run,
per day, per XX minutes of run time, per ??

What questions should we be asking?  We still have boards that require
touch-up after wave solder, is there anyone who has eliminated that need in
the DOD and space application world?

Thanks in advance to all that respond.

Ken Bloomquist
Sr. Staff Process Eng.


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