TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Fri, 01 Nov 96 05:38:37 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines)
From:  Stephen Ayotte
       EM Quality Engineering
       Bldg. 14-3 Col F5 5-1537
Subject: Fabrication
What is the most current information concerning a solderability
finish for raw cards and boards known as immersion silver?

**** IBM MD Product Quality Engineer       ****
****       OEM Quality Engineer            ****
**** Interenterprise Address: USIB6CEF     ****
**** Internet Address: [log in to unmask] ****

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2