Stephen,

For gold or nickel surfaces, IPC SM 840 C (newest rev) class T and H,
para 3.5.2 states; maximum adhesion loss of solder mask is 5%. The
procedure for test is TM 2.4.28. This basically call out for 3M 600 tape #"
wide over a checker board pattern.

I hope this info is useful. If I can assist further, I can be reached at
714-730-8356.

Bob Metcalf
Morton Electronic Materials

>>> <[log in to unmask]> 07/10/96 10:50am >>>

From:  Stephen Ayotte
\\\\\\\EM Quality Engineering
\\\\\\\Bldg. 14-3 Col F5 5-1537
Subject: PC Fab -Reply
I am referring to adhesion of an epoxy based solder mask coating when
coated on top of immersion gold and intended to ship to the customer in
that condition.  Almost in stead of SMOBC it would be
SMOIG (solder mask on immersion gold).

Thanks.

**** IBM MD Product Quality Engineer****
****         OEM Quality Engineer   ****
*** Forwarding note from SMTP2   --IINUS1   07/10/96 13:02 ***