One of our PCB suppliers is going to substitute the Blackhole through 
hole metallization process for their conventional electroless copper 
process. This supplier provides us with 4 to 10 layer boards, some of 
which have vias 0.010" in diameter.

This is a relatively new process. Supplier sponsored lab test reports 
are available which show favorable results. Something that I have not 
yet found are fabricators or end users of boards made with this 
process. I would appreciate hearing from people who have:

(a) assembled PCBs made with this process into their product and have 
some assemblies out in the field, or have done life tests on these 
assemblies,

or

(b) fabricated boards using this process and know from experience the 
robustness of this metallization process.

Vic Beldavs
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