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| Date: | Fri, 15 Nov 1996 09:42:00 -0500 |
| Content-Type: | text/plain |
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A PQFP on a FR-4 PWB does not have much of an expansion mismatch for anything
but very severe applications (automotive). Also depending how the encapsulant
fills the gap between component and PWB and how it is cured, it could act as
an underfill like for flip-chips.
W. Engelmaier
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