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Subject:
From:
Kaylor Karl <[log in to unmask]>
Date:
Thu, 11 Apr 96 15:17:00 PDT
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We are having a problem with melf diode components being open after reflow 
solder.  Would using the IPC detent pattern reduce this problem?

Karl Kaylor
[log in to unmask]
(317) 587-4684



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