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Subject:
From:
[log in to unmask] (Marshall Andrews)
Date:
Wed, 21 Aug 1996 18:05:18 GMT
Content-Type:
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Workshop to Enhance Relations Between Packaging Users and Suppliers
Co-sponsored by:    SEMI, and HDP User Group International Endorsed by:    
   ISHM and MCM Division of EIA 
 
 
SEMI Event #S6WER 
 
Date:         Wednesday, October 16 
Time:         1:30 pm - 5:30 pm 
Location:     Austin Convention Center, Austin, Texas, USA 
 
Registration Fee: 
Before September 16 
$125:00 Discounted SEMI/HDP User Group Member Price: $95:00 
After September 16 $195:00 
 
Registration contact Yanic Fridman, SEMI E-mail:       [log in to unmask] 
Phone:        USA 415 940 6996 
Fax:          USA 415 940 7943 
 
 
ABSTRACT 
 
This workshop focuses on the implementation of enhanced user-supplier
relations as it applies to packaging reliability
characterization/qualification. A new, more efficient, user-supplier
"handshaking" procedure for qualification of packaging will be presented.
The procedure creates win-win situations between users and suppliers and
brings benefits for both users and suppliers when implemented. 
 
Users present a Telecom companies common definition of use environments
which will facilitate the second level packaging reliability
characterization to be done by suppliers. Suppliers support of the new,
more efficient, user-supplier "handshaking" procedure for qualification of
packaging will also be presented. 
 
A panel discussion will finally be held aimed at demonstrating the interest
in the new procedures for strengthening user-supplier partnership in
packaging component to board qualification. 
 
Who Should Attend: System integrators, device manufacturers, package
fabricators and designers, contract manufacturers and equipment, materials,
and process suppliers. 
 
 
AGENDA 
 
1 Opening remarks - The importance of user supplier communications in
incorporating new high density packaging in system designs.  - Stan Xavier,
Nortel  
 
2 Operating idea of HDP User Group  
  - Ruben Bergman, HDP User Group  
 
3 Common Framework for device characterizations - Telecom Common
Requirement on package to board reliability, User/Supplier Collaboration  -
Monica Bakszt, Ericsson 
 
4 Real life experience of BGA:s 
  User and supplier know how 
   - ASAT  
   - Ericsson 
   - Nokia 
   - Nortel 
   - SGS Thomson 
  
5 Panel discussion: Lessons learned - Advantages of collaborative approach.
(users and suppliers that participated give their view of this process,
What advantages they see. What problems they see. There ideas on user
supplier relationship in HDP application.) 
 
ASAT,  Ericsson,  Nokia, Nortel, SGS Thomson (each 10 minutes, questions to
panel 20 minutes ) 
 
Break 
 
6 Telecom Use Environment Guideline - An example of one way to communicate
needs to  
suppliers 
 - Dave Kiang, Nortel  
 
7 Wrap up comments  
 
Ruben Bergman 
HDP User Group International Inc 
[log in to unmask] 

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