Subject: | |
From: | |
Date: | Wed, 19 Jun 96 08:48:00 CDT |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Good Morning,
We usually require soldermask over bare copper and tented vias (less than
.020"). This typically means that the soldermask is dry film. If a tented
via is not required and liquid soldermask is used, it appears that the
soldermask is suspect to flake off near the via knee, leaving a small amount
of exposed copper.
Is liquid solder mask over bare copper compliant with vias when the plating
is eletroless nickel - immersion gold?
Does the plating type matter?
Is the suspect of exposed copper a non-issue?
Thank you in advance of any comments.
Kevin Thorson
Lockhead Martin
Eagan, Mn
|
|
|