We are have following situation with a vendor: 

After the board house fabs the board in panels, the panels are scored. 
The panels are pulled apart to seperate the individual boards. 
The masking on traces near the edge gets pulled off exposing the copper trace.  
During the soldering process, the exposed traces get solder on them. 

Is this acceptable for Class 2 boards under IPC-610? 

If yes, is this actually called out somewhere in 610?

If no, is there a "fix" instead of outright reject in 610? 

Thanks in advance,

Doug

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Doug McKean
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The comments and opinions stated herein are mine alone,
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