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| Date: | Tue, 16 Jul 96 11:01:12 EDT |
| Content-Type: | text/plain |
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There is an article on"factors influencing solderability of electroless Ni-P
deposits" By Jing Li Fang, Xiang Rong Ye and Jing Fang in Plating and
surface finishing Vol 79 , No 7 , 1992 P44-47. In this article they talk
about the effect of the %P on the solderability and also other factors such
as the PH, bath temperature, complexing agent etc...
Start with this one.
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