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Date: | Thu, 13 Jun 96 14:01:00 EDT |
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This month's PCFab is the annual edition on Laminate suppliers. It will
answer most of your questions for you
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From: TechNet-request[SMTP:[log in to unmask]]
Sent: Tuesday, June 11, 1996 11:15 AM
To: [log in to unmask]
Subject: FAB: BT Resin
Have seen a number of literature articles indicating the standard
material
for a MCM-L is BT resin.
Question 1: Which laminate material suppliers make BT based resin
laminates?
Question 2: With the advent of multifunctionals what properties still
make
BT resin based laminates the preferred choice?.
Question 3: Do today's BT resin formulations still show the significant
shrink previously reported?
Question 4: Are there fabrication issues related to fine lines, feed
through holes or lamination that make BT resin based multichip module
boards
more challenging to the fabricators and thus make them less cost
effective
when compared to other resin systems of comparable glass transition
temperature?
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