Eugenio,
      I totally agree.  Your picture shows a basic registration error.  If 
you haven't already, work directly with your supplier on this.  Regardless 
of the source of the error, they should have caught it and let you know.  If 
the error is all theirs, they should be more than willing to replace the 
boards as well as provide you with written corrective action detailing the 
root cause of the error and the process changes put in place to eliminate it 
in the future.  If this is a problem for them, I would look for another 
supplier ASAP.
      Depending on the root cause and the layouts of your designs, internal 
spacing requirements may be violated as well because of the shift in the 
hole locations.

     Norm Dill

 ----------
From: TechNet-request
To: ebini
Cc: TechNet
Subject: Re: Hole breakout - request for opinions/assistance
Date: Wednesday, May 08, 1996 8:17AM

I would not use those boards.  We specify IPC-A-600 (rev E) - Class 2.  I
just browsed the section, it looks like the bitmap you sent fails all three
classes.  If your vendor can't solve the problem, I would start looking for
a new vendor.  We use three different vendors, I know that all three would
be extremely embarrassed - and would take the boards back no questions 
asked.

At 12:44 5/8/96, [log in to unmask] wrote:
>
>     We are an Australian manufacturer of electronic Telecommunications and 

>     Automated Fare Collection equipment. We use PCBs manufactured both
>     within Australia and overseas, specifying in all cases manufacture to
>     IPC-RB-276 standard.
>
>     We have recently discovered among our incoming goods widespread
>     incidence of annular ring breakout on the via holes of numerous
>     multi-layer boards. It appears to be the result of incorrect
>     registration during manufacture. The attached file contains an image
>     (in Windows Paintbrush Bitmap format) of a typical example on a
>     finished product.
>
>     We are not overly concerned about the 90deg. and 180deg. hole breakout 

>     cases, but greatly worried by the conductor/annular ring junction
>     cases. The functional tests of our finished products using these
>     boards show no malfunctions, but we are very suspicious about the
>     long-term reliability aspects. This is particularly so with those
>     finished boards whose design service environment is 60degC (140degF)
>     and >80% humidity.
>
>     We would be very grateful for opinions and/or assistance from people
>     with past experience of such a problem and first-hand knowledge of the 

>     long-term reliability implications.
>
>
>     Thanks in advance for your help.
>
>     Eugenio Bini
>     Mechanical Components Engineer
>
>     ERG Telecommunications Ltd.
>     247 Balcatta Rd.
>     Balcatta WA 6021
>     Australia
>     Tel.: +61-9-2731174
>     Fax.: +61-9-2731173
>     Email: [log in to unmask]
>
>The following is an attached File item from cc:Mail.  It contains
>eight bit information which had to be encoded to insure successful trans-
>mission through various mail systems.  To decode the file use the UUDECODE
>program.
>--------------------------------- Cut Here 
 ---------------------------------
>
>Attachment Converted: C:\EUDORA\ATTACH\pcb1.bmp
>
>
>

 -Pat-

 -------------
Patrick McGuine
Nicolet Instrument
[log in to unmask]
(608) 276-6334