(I placed this question a few days ago but received an eror message saying
it only went to a couple addresses)

We are looking for any testing that can be done after developing of dry film
resist. At present we do not have a feed and bleed system. We are using soda
ash for developer in a Chemcut 547. Resist is Morton(Dynachem) HG 2 mil.

We are trying to rule out imaging and developing as a problem cropping up
after etch that looks like dry film breakdown. We are pretty sure the
breakdown is happening somewhere along the plating line but as many of you
know how platers can be, we must rule out all other possibilities first. All
other processes in the imaging department can be calibrated and tested with
the exception of the developed dry film resist.

Any help is greatly appreciated.


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