TECHNET Archives

1996

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Subject:
From:
"Leo P. Lambert" <[log in to unmask]>
Date:
Sun, 27 Oct 1996 19:02:50 -0500 (EST)
Content-Type:
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EPTAC Corp. Presents 
                
                "The Total Electronics Manufacturing Process Seminar"

Who Should Attend:
This Seminar is intended for all Engineering and Manufacturing personnel
working in an electronic manufacturing /assembly environment and those who
supply product designs to the manufacturing environment.

Program Objectives:
To provide solid, practical information regarding critical and crucial
process elements.
To present methods of selecting proper materials and identify the pitfalls
encountered when introducing those materials into a manufacturing process.
To provide technical information that will help in the selection of certain
solder alloys.

Moderators:

Leo Lambert of EPTAC Corp.
Les Hymes of Les Hymes Associates
Bill Hampshire, of Hampshire Technical Services

DATE:  November 13-14, 1996
Place: Double tree Guest Suites, Waltham MA.

FOR INFORMATION:
			Call EPTAC Corp., 1 800 64-EPTAC
Program Schedule: DAY ONE
The Assembly Process,  Process Elements which Cannot be taken for Granted.
PTH Process Technology
SMT Process Technology
Mixed Technology

Integration of Low Residue Soldering Processes
Introduction and Overview
Material and Process Qualification
Quality and Cost Results
Additional Considerations
Case Studies
Lessons Learned
Best Practices

Metallurgy of Solders
The Best Guide to Solder Behavior
The Phase Diagram and What you Need to Know About It.
How a Solder Joint Ages
How To improve Solder Properties
Lead-Free Compositions and the Challenges in Using Them
Solder-Substrate Interactions
Wetting and Intermetallic Formation 
Oxidation
Solderability and Its Testing

DAY TWO:

Through Hole Connections Made During the Surface Mount Process

Cleanliness Assessment Practices for Cleaned and "No Clean" PWAs

Strength and Fatigue Resistance of Solder Joints.

Roundtable Discussion, Assembly/Design/Materials/Process Ideas and Questions.


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