can anybody give details of outgassing test mentioned by bob

thanks in reply
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>From what you have said it is is the solder paste in the holes causing the
outgassing and the voiding which does happen with via hole mounting due to
restriction of solvent evaporation from the holes. The Entek is not relevant to
the problem you describe.

If it were the boards then use the outgassing test I have talked and posted on
the Technet many times. My outgassing test video also shows how to test boards. 

I have been doing via hole mounting and if you get the profile correct you do
not get gassing.

Bob Willis
Process Engineering Consultant

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we find blowholes in entek finished pwbs.these are in bga pth holes. (finish 
dia 0.25 m.m) The coating thickness within specs (0.25 to 0.45). no blow
holes in other leaded components.

solder float tests done after entek with rma flux indicate good
solderability with NO BLOWHOLES (235 deg C) on bga holes.

the assembly process is apply solder paste, mount component and pass through IR
reflow.solder paste is screen printed on on bga holes also.

can somebody throw more info on above problem

thanks in advance

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