Technet Folk,

I sent in the following email the other day.  Soon afterwards all my 
email for for the next day or so fell into the Abyss From Which There Is 
No Return.  If anyone replied to my query, I missed it.  If so, could you 
please repost.
   
Thanks,

==========================================================
  Chris Stack
  ext. 231                       
  [log in to unmask]                    
  CD Electronics, Inc.                   
  Printed Circuit Board Designer and Purchasing Agent 
==========================================================
To understand the things that are at our door is the best
preparation for understanding those that lie beyond.
                                              -Hypatia
==========================================================

             ********** ORIGINAL MESSAGE FOLLOWS **********


I have seen a lot of talk on Technet recently regarding Cu Ni Sn board 
finishes.  Is this the same thing as what I have heard called "Soldermask 
over Tin/Nickel" or "The Santa Clara Process"?  If so, does anyone have a 
summary of the benefits/problems associated with this process?
   
Thanks,

==========================================================
  Chris Stack
  ext. 231                       
  [log in to unmask]                    
  CD Electronics, Inc.                   
  Printed Circuit Board Designer and Purchasing Agent 
==========================================================
To understand the things that are at our door is the best
preparation for understanding those that lie beyond.
                                              -Hypatia
==========================================================

             ********** ORIGINAL MESSAGE FOLLOWS **********

>We appreciate your Feedback Mr. Anderson, one more question, what is
>your surface prep (predip) prior to Tin plating.
>Regards / Wolfgang.

Wolfgang;

>From Nickel we have dragout rinses followed by a spray rinse, then
to a 10% sulfuric pre-dip before Tin plate. After copper plate we
also have a light microetch before the Nickel to eliminate the
possibility of peeling at the Cu/Ni interface.

Regards
George
----------------------------------------------------------------
Uvonics Co. Inc.                              [log in to unmask]


**************************************************************************
*
* TechNet mail list is provided as a service by IPC using SmartList v3.05 
*
**************************************************************************
*
* To unsubscribe from this list at any time, send a message to:           
*
* [log in to unmask] with <subject: unsubscribe> and no text.        
*
**************************************************************************
*


***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************