Michael:
     
     Thanks for the info.  Would you have a copy of the Motorola paper that
     you could fax to me?  FAX:  603-337-1027.
     
     Thanks again,
     
     Ron Yanuszewski


______________________________ Reply Separator _________________________________
Subject: Re [2]: Entec 106
Author:  [log in to unmask] at !INTERNET
Date:    11/4/96 6:40 PM


Hi Ron,
     
Solderability:
 - Solderability of OSP is affected by many factors. <<Enthone- the maker of 
Entek should be able to answer most of your questions>> You can use 
J-STD-003 to test the solderability of PCB.
Cleanliness
 - In case you have a misprint during paste application, you should make sure 
the cleaner chemistry compatible with your OSP. 
Joint Integrity
 - There is an interesting paper presented by Motorla at 1994 SMI Titled 
"Manufacturability and Reliability of Products Assembled with New PCB 
Finishes"
by Kingshuk Banerji and Edwin Bradley 
Coating Thickness
 - Entek 106+ is about 0.2 to 0.5  microns
     
Hope this helps
Michael Yuen
     
 ----------
From: TechNet-request
To: technet
Subject: Re: Entec 106
Date: Monday, November 04, 1996 1:33PM
     
     
     Technet people:
     
     We are also in the process of switching to OSP and we are trying to 
     set up reliability testing.  What are other assemblers doing to insure 
     product solderability, cleanliness, solder joint integrity, coating 
     thickness,etc.  Any help would be appreciated.
     
     Ron Yanuszewski
     Cabletron Systems
     
     
______________________________ Reply Separator 
_________________________________
Subject: Entec 106
Author:  [log in to unmask] at !INTERNET 
Date:    11/4/96 12:54 PM
     
     
     Jeffery Harry,  would you please expand on the "major problems" you 
     have seen by running Entek 106 in a dip mode.
     
     Peter Blokhuis
     PC World
     [log in to unmask]
     
     ----------------------------------------------------------------------
     
     
     
     If you use Entec 106, make sure that the PCB supplier has an in-line 
     process.  Dip tanks will cause major problems.  Also the PCBS need to 
     be thoroughly dried before packaging.  If not, you will have 
     solderability problems.
     
     Jeffrey_Harry @ 3mail.3com.com@ ugate
     
     ----- Previous Message
     ----------------------------------------------------
     
     
     
     To: Technet  @ ipc.org @ UGATE
     cc:
     From: EHolton @ vines.etn.com @ UGATE    Date: Thursday  October 31, 
     1996 02:40 PM Subject: OSP Coating
     ---------------------------------------------------------------------- 
     ----------
     ---------------------------------------------------------------------- 
     ---------- ------------------------------
     Fellow technetters:
     
     My company is beginning its research into the wonderful world of 
     organic solderability preservative coatings.  Our goal being to 
     implement this on the circuit boards in the near future.  I am looking 
     for any and all information that anyone may have....
     
*************************************************************************** 
* TechNet mail list is provided as a service by IPC using SmartList v3.05 * 
*************************************************************************** 
* To unsubscribe from this list at any time, send a message to:           * 
* [log in to unmask] with <subject: unsubscribe> and no text.        * 
***************************************************************************
     
     
     
*************************************************************************** 
* TechNet mail list is provided as a service by IPC using SmartList v3.05 * 
*************************************************************************** 
* To unsubscribe from this list at any time, send a message to:           * 
* [log in to unmask] with <subject: unsubscribe> and no text.        * 
***************************************************************************
     
*************************************************************************** 
* TechNet mail list is provided as a service by IPC using SmartList v3.05 * 
*************************************************************************** 
* To unsubscribe from this list at any time, send a message to:           * 
* [log in to unmask] with <subject: unsubscribe> and no text.        * 
***************************************************************************
     
     

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************