You wrote:
"i'm setting up reliability test system for my company. our company is 
electronics subcontractor which have COB, SMD and PTH production line.
do anybody know where can i find infor mation about what reliability test 
we need in each production process."
Oh boy, what a question! You do not write for what purpose you are setting up
the "reliability test system"; that can make all the difference in the world.
I assume, that your question pertains to testing of product to be shipped
(actually screening) not testing of prototypes and test vehicles, but I can
not be sure.  
Product Screens:
Burn-In: Is a functional test for some time (typically 8 to 24 hours)
involving perhaps worst case but still realistic operational environments.
Environmental Stress Screening (ESS): A screening procedure involving
environmental stresses of limited duration, such as thermal cycling, thermal
shock, vibration, mechanical shock, etc., designed to precipitate specific
suspected 'latent defects' or product weaknesses to failure (so these
failures can be detected) without causing significant damage to good product.
Highly Accelerated Stress Screening (HASS): A more aggressive screening
procedure involving environmental stresses, such as thermal cycling, thermal
shock, vibration, mechanical shock, etc., designed to precipitate specific
suspected 'latent defects' or product weaknesses to failure more quickly than
ESS. Higher acceleration means higher stress levels which can translate into
causing significant damage to good product. 
Accelerated Tests for Test Vehicles:
Accelerated Reliability Test: This is a test on test vehicles designed to
produce failures with the same damage mechanism product would experience in
the field on an accelerated basis. The purpose is to create a data base from
which product reliability in the field can be estimated. 
HALT (Highly Accelerated Life Testing): This is a test on product prototypes
to cause failures with very high stress regimens, but somehow still related
to the operational environment of the product. The damage mechanisms employed
in HALT, and thus the failures, may or may not have any connection of the
experiences of product in the field. This is an attempt to do an accelerated
reliability test quickly, which is can lead in many cases to misleading
information, because the high acceleration has brought about damage
mechanisms and/or material behavior that are not pertinent for product
reliability. 
HAST (Highly Accelerated Stress Testing): This is a test on product
prototypes to cause failures with very high stress regimens which show the
least robust portions of a design. By beefing up the observed failure sites
(often successively) a more robust product is arrived at. The damage
mechanisms employed in HAST, and thus the failures, may or may not have any
connection of the experiences of product in the field.

I would recommend two industry documents that deal, at least in part, with
reliability testing; IPC-SM-785, 'Guidelines for Accelerated Reliability
Testing of Surface Mount Solder Attachments' and IPC-D-279, 'Design
Guidelines for Reliable Surface Mount Technology Printed Board Assemblies'.
You may also be interested in a workshop I will be giving at NEPCON West'97
"Practical Design and Prediction Methods for Surface Mount Solder Joint
Reliability". The objectives of this course are to make the participants
familiar with the underlying technical issues; provide insights in the
relative importance of product quality resulting from workmanship standards
and process controls, and focused 'Design for Reliability;' give them an
appreciation of the reliability pitfalls in the design, reliability testing,
as well as environmental stress screening (ESS) of electronic assemblies; and
to present state-of-the-art, but simple to apply, tools for the 'Design for
Reliability.'  The attendees of the course will have an understanding of the
solder behavior under load and fatigue which is necessary for the successful
design, manufacture, and testing of electronic assemblies. Processing issues
to achieve the consistent solder joint quality necessary to assure
reliability will also be discussed.  
The information presented has been included in the industry documents
IPC-SM-785, 'Guidelines for Accelerated Reliability Testing of Surface Mount
Solder Attachments', IPC-D-279, 'Design Guidelines for Reliable Surface Mount
Technology Printed Board Assemblies', ANSI/IPC J-STD-012, 'Implementation of
Flip Chip and Chip Scale Technology', and ANSI/IPC J-STD-013, 'Implementation
of Ball Grid Array and Other High Density Technology'.  

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 201-543-2747
E-mail: [log in to unmask] 

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