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Date:
04 Sep 96 16:16:00 EDT
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Questions from a telecomms designer:

What is the max continuous operating temperature for a COMPONENT on a vertically
orientated PCB (without  thermal management) without causing "damage" to the
substrate?

Has anyone derived a time/temp situation in reflow that would result in
significant degregation of the PCB such that personnel might be affected by
toxic fumes?

Thanks,   George Wheadon  

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