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Subject:	ASSY: SPEC FOR PULL TEST
From:	[log in to unmask]
Date:	Thu, 08 Aug 96 19:46:27 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (24 lines)

From: Paul Leger
Subject: ASSY: SPEC FOR PULL TEST
Hi there,

Just wondering if a spec (IPC preferably) exist for the minimum amount of
force required to pull and shear SMT components off a PCB in a solder
paste process after the card has been reflowed.

If it's an IPC spec I just need the spec number.

later,
Paul Leger
Process Engineering (SMT)
[log in to unmask]          (416) 448-4712

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