Hi, Doug.
There was a paper written by C.J. Chen, J.P. Partridge, B. Hussey, and
A. Gupta of  the IBM Watson Research Center in Yorktown Heights, NY in
1991 titled  *Self-Induced Repair of Printed Circuit Boards* which
describes a self-limiting plating repair method for near-opens.
Accorcing to the article, published in the June, 1991 issue of  Plating
and Surface Finishing magazine, it can also be used to repair opens (or
create new interconnections)  with the addition of a simple laser
seeding process.

Mike Matson
Woodward Governor Company
(970) 498-3285

"Its bad luck to be superstitious"
 ----------
From: [log in to unmask]
To: [log in to unmask]; [log in to unmask]
Subject: FAB: Trace Repairs
Date: Monday, October 28, 1996 6:00PM

 -- [ From: Doug Jeffery * EMC.Ver #2.5.1 ] --

I am wondering if anyone has approached the repair of lines less than .
005" (internal layer).  We weld some .005" lines but haven't been doing
any repair below that.  Are there any plating repair methods for lines
of .004 and .003?  Anyone have an opinion on welding .003" lines?


Thanks in advance for your opinions.


Doug Jeffery
Electrotek, Inc.

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