FREE (NO CHARGE) PHOTO DEFINED MICRO-BLIND VIA TECHNOLOGY WORKSHOP
SPONSORED BY CONTINENTAL CIRCUITS, FL.
A new way to manufacture higher density, lower cost
blind via PWBs, without drilling the holes
Thursday Nov 14th, 1996, Westford Regency Inn, Westfod, MA
(Tel :: (508) 6928200)
HALF DAY FROM 12.00 NOON - PLEASE CALL OR E-MAIL TO REGISTER BY FRI NOV 8TH
BRIAN MCDERMOTT (407) 6995000, EMAIL :: [log in to unmask]
AGENDA AS FOLLOWS ::
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12:00 pm Lunch
1:00 pm Introduction
Continental Circuits, Inc., FL
Leo Spotts, President
1:20 pm Packaging Strategies for next generation systems
Prismark Partners LLC.
Charles Lassen, Founder and Managing Partner
Leading companies in the electronics industry consult with Prismark Partners
to provide high level strategies based on detailed intelligence. Prismark
Partners works with all market sectors and at all levels of management to
bring a detailed and practical understanding of the electronics industry to
critical management decisions that have large financial implications.
Charles Lassen's experience includes the selection and management of
technology based venture capital investments for corporate investors. He has
developed and marketed leading edge packaging and interconnection
technologies and holds several US patents.
In this presentation, Prismark Partners will take a systems company view of
the need for SBU technology, the applications, the current and expected
price benchmarks and the industries building supply infrastructure.
2.00 pm An Overview of SBU (Seqential Build-Up) Technologies
Ciba Geigy Corp
Ivan Ho, Marketing Manager, Ciba Polymers
Ciba Polymers develops and markets high-performance specialty products and
formulated systems for high technology and industrial markets. Ciba
Polymers, along with Ciba's four other US Specialty Chemicals divisions
(Additives, Chemicals, Pigments and Textile Dyes) are a wholly-owned
subsidiary of Ciba-Geigy Ltd. Basel, Switzerland. Capitalizing on Ciba's
technology leadership in photochemistry and polymer science, Photopolymers,
a business group within the Polymers division, is specialized in providing
leading edge photoimageable products for PWBs and the electronic packaging
industry.
Beyond the hype and heavy trade journal coverage, this talk will be a
technology assessment of SBU, covering the following
- the SBU market activity update
- a closer look at all available SBU approaches
- process and cost comparisons
- keys to success in SBU.
2:40 End use Characteristics of High Density PWB's
fabricated using photoimageable dielectric processes.
Shipley Company Inc.
Art Wolfrum, Business Manager, Advanced Interconnect
Shipley Company is a leading, worldwide supplier of PWB metallization
processes and liquid photo-resists for the manufacture of integrated
circuits. Shipley Company has been instrumental in the development of
photoimageable dielectric processes for the manufacture of SBU, high density
multilayer PWB's. Shipley Company is located in Marlboro MA and is a
division of Rohm and Haas, Philadelphia PA.
Discussed will be the process requirements for the metallization of PWB's
manufactured using Photoimageable dielectrics as well as the expected end
product properties and capabilities of multilayer circuitry fabricated using
SBU techniques.
3:20pm Designing with Microvias
PCA Design, Inc.
Steve Bird, Owner.
Steve Bird started PCA Design 3 years ago. Today they have over twenty
employees and offices in two states. For the past 2 years Steve has worked
closely with Hewlett Packard to refine the SBU design process. Steve and PCA
design have more experience designing to this new and exciting manufacturing
process than any other company. Steve is recognized worldwide as an expert
in microvia design methodologies.
Steve's talk will discuss each of following design needs
- EMI, RFI, Signal Integrity
- DFM, PWB Technology and Assembly Technology
- Routability
He will show how each of these needs are addressed with microvia
technologies, outline solid design methodologies, and end with some common
design questions and some possible answers.
4:00 pm Practical Applications of photo defined via
technology (PhotoLinkTM).
Continental Circuits, Inc. FL
Brian McDermott, New Product Manager
CCI is a leader in high density, small form factor, blind via PWBs. They
will introduce PhotoLinkTM, a SBU (Sequential Build Up) technology, using
photo defined vias in a photoimageable dielectric material, no drilling
required. In 1995 CCI became the first non-captive US supplier to begin
production of UL qualified SBU PWBs. Brian has worked on development of
photo defined via technology for the last 3 years at CCI. He has regularly
published in trade journals and spoken at trade shows and conferences.
Discussed will be the significant design and cost benefits of PhotoLinkTM
technology for current and future products. We will outline how you can use
this technology to reduce the cost of current SMT designs. Examples of
current designs using and benefiting from PhotoLinkTM will be presented. The
actual manufacturing process will be described along with photographs and
reliability data. Samples of PhotoLinkTM boards will be made available for
your evaluation.
4:40 pm
Open Discussion/Cocktails
________________________________________________________________
Brian McDermott
New Product Manager
Continental Circuits
1150, Belle Avenue,
Winter Springs,
Fl 32708, USA
Tel: 407 6995000
Fax: 407 6996871
email: [log in to unmask]
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