Subject: | |
From: | |
Date: | Tue, 24 Sep 1996 08:22:15 +0000 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
While answering another technet question on buried via, I had one of my
own.
In the late 1980's, I recall seeing a study (IBM-Endicott?) which
demonstrated that the most reliable via thickness with respect to Z-axis
expansions was something like .5 - .7 mil. Was this just wishfull
thinking?
If this is so, why have we not pursued it as a standard? If it is a
better thru hole, wouldn't I (now a consumer of PWBs) want that? And
wouldn't every PTH house like to reduce their plating times by 30%?
Is a possible answer: The extra copper is to ensure coverage. I have
known boards with copper thickness of .4-.6 mil to have problems with
blow holes in the assembly process.
George Franck
Raytheon E-Systems
Falls Church Va
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|