Mime-Version: |
1.0 |
Content-Type: |
text/plain; charset=us-ascii |
Old-Return-Path: |
|
Date: |
Tue, 24 Sep 1996 08:22:15 +0000 |
Precedence: |
list |
Resent-From: |
|
From [log in to unmask] Wed Sep 25 08: |
37:56 1996 |
Content-Transfer-Encoding: |
7bit |
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
X-Status: |
|
X-Loop: |
|
Resent-Message-ID: |
<"1Wx1P3.0.lP9.S0zHo"@ipc> |
Subject: |
|
From: |
|
Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0v5WLV-0000QuC; Tue, 24 Sep 96 07:12 CDT |
Resent-Sender: |
|
X-Mailer: |
Mozilla 2.01 (Macintosh; I; 68K) |
Message-Id: |
|
Parts/Attachments: |
|
|
While answering another technet question on buried via, I had one of my
own.
In the late 1980's, I recall seeing a study (IBM-Endicott?) which
demonstrated that the most reliable via thickness with respect to Z-axis
expansions was something like .5 - .7 mil. Was this just wishfull
thinking?
If this is so, why have we not pursued it as a standard? If it is a
better thru hole, wouldn't I (now a consumer of PWBs) want that? And
wouldn't every PTH house like to reduce their plating times by 30%?
Is a possible answer: The extra copper is to ensure coverage. I have
known boards with copper thickness of .4-.6 mil to have problems with
blow holes in the assembly process.
George Franck
Raytheon E-Systems
Falls Church Va
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|