Subject: | |
From: | |
Date: | Fri, 23 Feb 96 10:33:42 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Item Subject: cc:Mail Text
As mentioned in several other messages, we have found no reliability
problems associated with exposed copper on OCC assemblies.
However, I have one question which I hope someone can answer:
On some assemblies, we use grounded contact pads to ground
shields/bulkheads, etc. The contact between the shield and the board is
simply a metal tab on the shield that presses against a contact pad on
the board. Is such a connection reliable if the pad is exposed copper
(or copper with residual OCC after a couple of reflow cycles and an
aqueous wash)as opposed to HASL? Pasting those pads is not possible in
all applications due to the size, number of pads, etc.
Regards,
Denis Mori
Hewlett-Packard Co.
Roseville, CA
[log in to unmask]
|
|
|