We are a circuit board surface finishing services provider in Austin, 
     TX.  We currently are running a high volume part number for a customer 
     through our hot air solder leveling line.  The part is in large panel 
     format and the design dictates that the gold edge connectors are 
     plated before solder leveling step.  Their are 60 pcs. per panels that 
     we are covering with a Furon/CHR C690 tape.  We roll the tape in a 
     DuPont HRL-24 resist laminator with the rolls are room temp.  The 
     panels are detaped after solder leveling and the tape leaves behind 
     quite allot of residue.  We have tried residue free tapes, but they 
     won't hold up to the horizontal leveling process.  We are hand 
     cleaning the residue with a terpene based solvent made by MicroCare.  
     The process is operator dependent and we are getting scrap escapes to 
     the customer due to the residue.
     
     Can anyone offer any suggestions to assist in solving this problem 
     such as a good sprayable aqueous cleaner, a better "residue free" 
     tape, or a good screenable, peelable solder mask process?
     
     Any suggestions would be extremely appreciated.
     
     Michael Holan
     Process Engineer
     Radian International, LLC
     Electronics Div..
     
     ph.: 512/310-4209
     fax: 512/288-0898
     e-mail: [log in to unmask]

    We have the similar problem quite sometimes ago but we manage
    to resolve the issue with the tape supplied by Plaschem(S)Pte Ltd
    and bake the panel after taping and go through the roller . You
    could give a try . Thanks

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