Well I am sorry that you could not contact me directly but here is the
information on the video tapes, poster sets and all that good stuff. Also you
may be interested that I now have a Home Page which covers all the material plus
it provides new  FAQs on BGA, Reflow Soldeing and Temperature Profiling and
thats not all. If you need in-house training the standard courses are all
covered on the Home Page.
Finally i will be conducting two workshops and one PAC at Nepcon West so see you
at the show in the BIG ROOM.

Bob Willis
Electronic Presentation Services
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Home Page: http://ourworld.compuserve.com/homepages/bwillis

Introduction to BGA Technology
Duration: 55 minutes 

Component types
Design requirements
Screen print and reflow process
Inspection and quality control
Rework and repair
Process problems and solutions


Wave Soldering Process Control
Duration: 28 minutes
   
Wave soldering process
Soldering materials
Process parameters
Setting process parameters
Quality control checks
Common soldering defects


Guide to Solder Paste 
& Screen Printing
Duration: 55 minutes   

Solder paste selection
Screens and stencils
Practical machine setting
Solder paste thickness measurement
Quality control standards
Common screen printing defects


Wave Solder Defect Monitoring
Duration: 25 mins + spreadsheet

Wave solder introduction
Solder yield calculation
Manual & automatic charts
Practical examples
Wave solder defect types


Wave Solder Machine Operation/Maintenance
Duration: 45 minutes

Guide to wave soldering
Operation of equipment
Maintenance of:  
fluxer	solder pumps
pre-heat	solder wave
conveyor	fingers
Health & safety
Maintenance procedures


Surface Mount Rework & Repair
Duration: 37 minutes   

Removal/replacement of components
Adhesive removal
Solder short removal
Fine pitch repair
Common repair defects
Health & safety


Solderability Testing 
SMT Components
Duration: 26 minutes

Solderability theory
Component storage conditions
Manual and automatic testing
Solderability criteria
Common solderability defects


De-Soldering Conventional Components
Duration: 24 minutes

De-Soldering theory
Equipment operation
Component removal
Component replacement
Maintenance of equipment
Hand soldering


PCB Outgassing Test Kit
Duration: 10 mins + test procedures 	

Introduction to blow holes/pin holes
Reliability of solder voids
Non-destructive test method
Practical testing procedure
Accept and reject test examples


Reflow Soldering & 
Temperature Profiling
Duration: 30 minutes   

Surface mount assembly
Reflow soldering theory
Vapour phase
Infra-red soldering
Convection reflow
Hands-on temp. profiling methods
Common reflow soldering defects

Introduction to Conventional Assembly
Duration: 40 minutes   

Design Rules
Components
Printed Boards
Component Pre Forming
Manual Assembly
Automatic Assembly
Static Control
Hand Soldering
Wave Soldering
Cleaning
Inspection 
Rework
Soldering Defects


European Inspection 
& Quality Standards
Duration: 30 minutes 

Criteria for:  	
screen printing 
component placement
conventional solder joints
chip components
 J-leads
 gull wing terminations
wire terminations
Common SMT soldering defects


Guide to Basic PCB Manufacture 
Duration: 22 minutes   

Laminates
Drilling operations
Plating
Solder resists
Solder finishes
Panel routing
Microsection examples


Static Control in Electronics
Duration: 30 minutes

Static generation
Component damage
Use of: 	
wrist straps	heel straps
conductive bags	work benches
work coats		trap testers
Static control standards


Introduction to Inert Soldering
Duration: 45 minutes 

modern assembly processes
inert gas advantages
benefits of nitrogen soldering
inert reflow/wave soldering
nitrogen gas supply
cost justification
Colin Lea/Chris Tanner interviews


SMT/Conventional Design for Manufacture
Duration: 55 minutes 

Component selection
Component packaging
Solder resist types and solderable finishes
Hole sizes and pad sizes
Component positioning
Break out points
Fiducial marks and tooling
Laminate materials
Stencil requirements


Introduction to Contamination Testing
Duration: 40 minutes 

Modern assembly techniques
International specifications
Printed circuit board failures
Ionic contamination measurement
Surface insulation resistance measurement


Introduction to X-Ray Inspection
of BGA and Fine Pitch Joints
Duration: 35 minutes 

Criteria for:  	
component placement
BGA joints
chip components
 J-leads
 gull wing terminations
Common SMT soldering defects
Test sheets for operator assessment


Introduction to Surface Mount Technology
Duration: 45 minutes

Component types
Component packaging
Design rules
Solder paste printing
Adhesive application
Reflow/wave soldering
Inspection
Rework and repair
Cleaning
Soldering defects



QUALITY CONTROL & TRAINING WALL CHARTS


Basic Printed Circuit Board Manufacture - a basic step by step guide to the
manufacture of double sided/multi-layer printed circuit boards

Wave Soldering Defect Guide includes common wave soldering defects and their
possible causes including blowholes, shorts, skips and balling

Conventional Soldering Standards includes accept/reject criteria for lead
length, lead clench angle, single sided and double sided solder joints

Printed Circuit Board Manufacturing Defects - examples of defects including
resist lift, outgassing, delamination, solder balling and  possible causes

Surface Mount Soldering Standards - criteria for solder paste, adhesive,
component placement and solder joint standards for all terminations

Conventional Wire Termination Standards includes accept/reject criteria for wire
preparation, termination and solder joint assessment

Surface Mount Assembly Defect Guide illustrates process defects at screen print,
adhesive dispense, placement, soldering and cleaning stages

Surface Mount Component Recognition - photographs of the most common surface
mount component types and their packaging 

PCB Microsection Reference Charts - photo micrographs of satisfactory through
hole and circuit plating and many common manufacturing faults

Ball Grid Array Soldering Guide - X-Ray inspection guide of satisfactory BGA
solder joints and process defects

Please send your order together with your sterling cheque drawn on a UK bank for
L45 pounds sterling + VAT in Europe to EPS.

If you require information on EPS' other training services please contact 

Bob Willis
Electroinc Presentation Services
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Home Page: http://ourworld.compuserve.com/homepages/bwillis