Antitarnish????
     Do you mean post oxide process??
     (Like DMAB?)
     
     (Sounds like your microetch was spent or contaminated. Did somebody
     run double treat through it?)
     
     Dave Hoover


______________________________ Reply Separator _________________________________
Subject: Delamination
Author:  [log in to unmask] at SMTPLINK-HADCO
Date:    5/27/96 10:39 AM


We have detected a large delamination on all boards from one of our 
production batches. This delamination appears in the SMT IR oven (short 
wave) step in our customer facility.
Curiously the delamination takes place between black oxide and base copper 
interface. In other words, the black oxide layer peels away from his own 
base copper and remain stick on epoxy resin. The stripped Cu appears pink.
     
We suppose that we made a mistake in B.O. process but we don't know where 
exactly.
Our B.O line has de following steps: 
Sodium persulfat microetching
Black oxide (Shipley)
Oxide reduction (Shipley)
Antitarnish and rinse
Hot air drying.
Did somebody hear about this kind of delamination?. If yes, which is  the 
B.O. wrong parameter?
Excuse my English.                                                thanks in 
advance.
     
 Jos=E9 Muelas