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1996

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Subject:
SMT Component Packaging
From:
"Bill Fabry" <[log in to unmask]>
Date:
11 Sep 1996 10:38:50 U
Content-Type:
text/plain
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text/plain (19 lines) 
Is there a comprehensive document(s) (IPC, EIA, etc.) specifying "Tape-&-Reel"
packaging specifications for surface-mount ICs and passive components?  What
is the largest IC generally packaged in tape/reel, as opposed to conductive
trays?

Thanks in advance for your help.

Bill Fabry
Truevision, Inc.

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