I would think the only thing left would be to simulate the customers 
     wire bond process yourself, to be sure you meet their pull strength 
     parameters. Need to know wire diameter and attachment method (wedge or 
     ball) then find someone who can do the bonds and pulls for you. This 
     works as a good process indicator for the gold plating process you're 
     using and can give an indication of contaminants too.


______________________________ Reply Separator _________________________________
Subject: Wire Bonding
Author:  [log in to unmask] at INTERNET_GATEWAY
Date:    10/15/96 4:12 PM


Advice please !
Is there a quantitative test that can be carried out on soft gold electroplate 
to qualify its suitability for wire bonding ?
 Gold thickness and purity already to customers spec.
Note in this instance gold is on a nickel undercoat.
     
Jim Douglas
Kam Circuits
     
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