TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Mon, 25 Nov 1996 13:22:18 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines)
Having run analysis on solder a number of times in the four different ways.
 The different method tend to provide slightly different compositional
answers which shouold somewhat over ride the worry about whether it is
exactly eutectic or not.  Also specs. call out the tin and some other
elements with remainder lead.  Many solders contain antimony up to 0.5 Sb.
 They also have a host of other impuities listed as max., but adding together
that may also have a impact on the remainder Pb % which may fall below the
eutetic mix.  Also the total solder joint does not cool in the same
micro-micro second so there may be liquidus and solidus existing n the same
joint a one time.  Solder that is near eutectic is near enough for any
applications that I am aware.

Phil Hinton 
Hinton "PWB" Engineering .

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2