TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Paul Gould <[log in to unmask]>
Reply To:
Date:
Mon, 30 Dec 1996 10:39:48 GMT
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines)
In your message dated Friday 27, December 1996 you wrote :
> It seems that entropy does not govern when it comes to copper in HASL. 
> Removing the dross significantly affects copper levels with the
> occasional addition of solder bars.
> Has anyone found a way to recycle tin/lead 'in house' and purify the
> solder for reuse?  
> Chemically or metallurgically there has to be a way it seems. 
> 
I am not sure of the mechanism but holding the solder pot at around 180 deg C 
overnight will cause copper to oxidise/crystallise out on the surface. It can 
then be scraped off with the dross. If this is done daily you can keep the 
copper level consistently low and avoid changing the solder. This is an 
automatic procedure on our CEMCO Quicksilver machine.

Happy New Year 
Paul Gould
EMail [log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************



ATOM RSS1 RSS2