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1996

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Subject:
From:
"dmitchel" <[log in to unmask]>
Date:
Thu, 25 Jan 96 06:45:53 PST
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 yes, gold does alloy with tin and lead: Au6Sn, AuSn, AuSn2, AuSn4, & Au2Pb
 (from table in H. Manko's book Solders and Soldering)


______________________________ Reply Separator _________________________________
Subject: Re: Sn-Pb etch
Author:  [log in to unmask] at corp
Date:    1/25/96 5:42 AM


As far as gold is concerned, doesn't the gold alloy into the solder.  If so 
the gold "underlying intermetallics" are already touched.  This might 
explain the gold re-precpitating, since it won't go into an HCl solution.
 
>Subject: Sn-Pb etch
>Author:  [log in to unmask] at corp
>Date:    1/24/96 10:58 AM
>
>
>Can anyone recommend a method to completely remove the 63-37 solder from a 
>surface, leaving the underlying intermetallics untouched?   I have tried 
>hydrochloric acid; it works for solder reflowed on Cu, but in joints with 
>gold it apparently re-precipitates gold artifacts.  Any help would be 
>greatly appreciated.
>
>Edwin Bradley
>Motorola
>
 
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