Hello, in response to your answer, this is not recommended.  The plastic
material of DIPs is different than the material used in the typical surface
mount components.  Since the process of Surface Mount exposes all the
components to the reflow temperature, the moisture entrapped within the
components will expand causing reliability damage to the devices.  You
should investigate the conversion of PTH devices into SMT devices to
alleviate this kind of situation.

Best of Luck

Leo Lambert
Technical Director
EPTAC CORP.

At 09:13 AM 10/22/96 EST, Hollandsworth, Ron wrote:
>     Good Day TechNetters!
>       
>     What experience can you all share about forming through-hole 
>     DIP packages into a surface mount configuration (J-leaded?) 
>     so that the part(s) can be mounted and reflowed during the 
>     SMD operation?
>     
>     Is there automatic equipment available to form the DIP 
>     leads?  If so, who are the manufacturers and what would be a 
>     ballpark cost?  
>     
>     Has reliability testing been done to validate solder joint 
>     integrity?
>     
>     Is anyone using pick & place equipment to automatically 
>     place the newly formed part(s)?
>     
>     Ron Hollandsworth
>     [log in to unmask]
>     ITT A/CD
>     Fort Wayne, Indiana
>
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