Good Day TechNetters!
       
     What experience can you all share about forming through-hole 
     DIP packages into a surface mount configuration (J-leaded?) 
     so that the part(s) can be mounted and reflowed during the 
     SMD operation?
     
     Is there automatic equipment available to form the DIP 
     leads?  If so, who are the manufacturers and what would be a 
     ballpark cost?  
     
     Has reliability testing been done to validate solder joint 
     integrity?
     
     Is anyone using pick & place equipment to automatically 
     place the newly formed part(s)?
     
     Ron Hollandsworth
     [log in to unmask]
     ITT A/CD
     Fort Wayne, Indiana

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