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Subject:
From:
Poh Kong Hui <[log in to unmask]>
Date:
Wed, 18 Sep 1996 08:07:47 +0800
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Hi Ed,

As I realise you have thru' hole component before epoxy application. As 
for our process, we insert the thru' hole after the SMT process. That's the
difference between your process and ours.
I am not too sure about the print life. However, I have been printing since ]
year 92.. 

The reason why I started off with this method is due to insufficient output 
from dispensing machine. I have to feed 2 SMT lines for the same models.
The volume during is pretty high.. I have problem at the beginning with the
epoxy thickness. The SOIC package has a pretty high stand-off. Later,
I have mounted 4 pieces of  small 5 mil thick plate at bottom corners of the
stencil. I work OK but inconsistent. Later, I re-design the stencil using the 
plate thickness of 12 mil, play around with print speed and squeegee 
pressure.  It works well. 

I only using Camalot for pilot run or Screen printer down for maintenance.

We presently run a model, about 300 points at the solder side, that
require epoxy to hold the component, Epoxy used is Loctite 3607 and 
the line has continue running this product for 6 days without changing 
the epoxy.  So far the printing quality is pretty OK. 
I have try Loctite 3612, it works pretty well too. Except for the smell.

To remove the epoxy or clean the stencil that with epoxy, I guess you 
have to check with Loctite. They have a good epoxy remover. So far I 
have evaluated it, but have not use it, I still have some old ex-stoxk chemical
that blend by one of our local companies.

I am not sure that I have answered correctly. Please do Email me if you need
any info' that I able to provide.

--------------------------------------------------------------------
At , you wrote:
>Poh Kong Hui
>
>You stated that you are stencil printing your smd adhesive.  I am aware of 
>the process and read about it.  We presently build mixed technology boards 
>so this process is not necessary for us, we dispense adhesive because the 
>thru-hole parts are already in the PCB.  I would like to know why you chose 
>this process, how you are using it in production and the problems and 
>successes that you have with the process, especially in the print life and 
>cleaning.
>
>Anyone else is welcome to answer also.
>
>Thanks
>
>Ed Holton
>[log in to unmask]
Poh Kong Hui 
Nera Electronics
Fax: (65) 7765492

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