TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
[log in to unmask] (DARDA HAYES)
Date:
Tue, 9 Jul 1996 16:19:36 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines)
  TechNet,
  
  I have an issue concerning the 500 hour Electromigration Resistance Test 
  outlined in Bellcore spec. TR-NWT-000078, Issue 3, December 1991.
  
  The issue is that we are performing a PCB evaluation of a potential vendor 
  and are really pressed for time.  We do not want to take any short cuts in 
  our evaluation but would like to find out if there is an alternative to 
  running this test for 500 hours.  Are there any parameters of the test that 
  can be altered thereby shortening the duration (i.e. chamber humidity, 
  temperature, voltage, current)?
  
  Any opinions or information that will enlighten me on this matter would be 
  greatly appreciated.  Thanks in advance.
  
  D'Arda Hayes
  Hitachi Computer Products (America), Inc.

The mail list is provided by IPC using SmartList v3.05
To unsubscribe from this list at any time, send a message to:
[log in to unmask] with <subject: unsubscribe> and no text. 



ATOM RSS1 RSS2