Ruben Bergman sent me a note about a workshop that the HDPUG (high Density
Pkg. Users Group) will be running on Wednesday, Oct. 16 from 1:30 to 5:30
p.m. during SEMICON Southwest at the Austin Convention Center in Austin, Texas.

ABSTRACT:

This workshop focuses on the implementation of enhanced user-supplier
relations as it applies to packaging reliability, characterization, and
qualification. A new, more efficient, user-supplier "handshaking" procedure
for qualification of packaging will be presented. The procedure creates
win-win situations between users and suppliers and brings benefits for both
when implemented.

Users will present a "Telecom Companies" common definition of use
environements which will facilitate the second level packaging reliability
characterization to be done by suppliers. Suppliers support of the new, more
efficient, user-supplier "handshaking" procedure for qualification of
packaging will also be presented.

A panel discussion will be held aimed at demonstrating the interest in the
new procedures for strengthening user-supplier partnerships in component to
board qualifications. 

For information and registration contact Yanic Fridman at SEMI
(Semiconductor Equipment Manufacturers International): e-mail
[log in to unmask]; phone 415-940-6996; Fax 415-940-7943.
Ron Gedney
[log in to unmask]
Integrated Electronic Eng. Center
Watson School of Eng. & Applied Science
Binghamton University
P.O. Box 6000
Binghamton, NY 13902
607-777-4335, fax 4683

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