We are please to be able to provide the following Call for Papers for IPC
Printed Circuits Expo '97 (March 97) in San Jose California.
Regards
__________________________________________________
David W. Bergman, Technical Director
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
847-509-9700 x340 Phone
847-509-9798 Fax
email [log in to unmask]
www http://www.ipc.org
faxback support 800-646-0089
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CALL for PAPERS IPC Printed Circuits Expo ‘97
March 9-13, 1997 San Jose Convention Center San Jose, CA
Technical Conference - March 9-13, 1997
Exposition - March 11-13, 1997
Produced by:
IPC, Northbrook, Illinois
Hosted by:
California Circuits Association
Sponsored by:
Arizona Printed Circuits Association
Chicagoland Circuits Association
Midwest Circuits Association
Michigan Printed Circuits Association
North East Circuits Association
IPC PRINTED CIRCUITS EXPO `97
IPC Printed Circuits Expo `97 is the largest conference and
exhibition in North America focused exclusively on the PWB
industry. Held at the San Jose Convention Center, the 1996
event was a resounding success with 221 companies displaying
their products and services. National and international
attendees reached 3,500. IPC Printed Circuits Expo brings
together all the elements of the electronic interconnection
industry: users, assemblers, fabricators and suppliers. This
year we plan to build this success again! To date, more than
250 exhibitors plan to exhibit at the IPC Printed Circuits
Expo `97.
UNPRECEDENTED INDUSTRY SUPPORT
IPC Printed Circuits Expo is supported by every Printed
Circuit Association in the United States, which makes it an
unprecedented event. The following organizations have
recognized the importance of this activity to the electronic
interconnection industry:
- Arizona Printed Circuits Association
- California Circuits Association
- Chicagoland Circuits Association
- Midwest Circuits Association
- Michigan Printed Circuits Association
- North East Circuits Association
WHY SHOULD YOUR COMPANY BE A PART OF THE TECHNICAL
PROGRAM?
IPC's Technical Programs are the bedrock on which nearly all
other IPC programs are built. Your participation in Printed
Circuits Expo `97 is your chance to be involved in the
standardization process and the advancement of technology.
Today, standards and specifications define what the customer
wants. It's essential to understand your customer
requirements. IPC Printed Circuits Expo will bring together
members of the PWB industry who are involved in shaping the
industry's response to the next set of manufacturing
challenges. Your participation will ensure that you don't
miss out on this tremendous opportunity.
Also, a presentation at a premier event like IPC Printed
Circuits Expo can mean important exposure for you and your
company. In addition, IPC Printed Circuits Expo can enhance
your professional reputation, as you reach a large audience
of your peers.
TECHNICAL SESSIONS,WORKSHOPS AND TUTORIALS
Expanding on the 37 year history of IPC Annual Meetings, a
major technical conference is one of the primary attractions
of IPC Printed Circuits Expo. The event, with nearly 70
technical paper slots, will feature applications-oriented
presentations on the latest developments in PWB fabrication
and assembly. In addition, in-depth workshops and tutorials
will be conducted to address the industry's need for
increased training.
HOW CAN YOU BECOME A PARTICIPANT?
Chair a Technical Session or Panel Discussion
Requirements: Technical Session/Panel Discussion (onsite
time required three hours): Comprised of four to five
speakers from different companies/organizations speaking on
various areas of a common theme. Individuals interested in
organizing a session of this type must provide a proposed
session scope and tentative speaker names by September 7,
1996.
Present a Paper at the Technical Conference
Requirements: Presenting a paper - 30 minutes and providing
print quality material for proceedings; abstract submission
of 200-300 words; a brief biography. Presentation materials
and papers must be noncommercial in nature. Papers submitted
should describe significant results from experiments,
emphasize new techniques, discuss trends of interest, and
contain technical, economic, or appropriate test data.
Important: Papers focused on a company's product, rather
than on the technology, will not be accepted. Also, it is
mandatory to publish a paper in order to make an oral
presentation.
The deadline for abstract submission is September 9, 1996.
The deadline for paper submission is January 10, 1997.
Lead a Workshop or Tutorial
Requirements: Tutorial (on-site time required: six hours) or
Workshop (on-site time required: three hours)--comprised of
one or two speakers giving in-depth coverage of a topic. Due
to the amount of work required for preparation of the course
and workbook, an honorarium is offered for tutorial
presentations.
Deadline for abstract submission is September , 1996.
PRESENTATION PROPOSAL FORM
Presenter ( )IPC Member ( )Nonmember
Name Title
Organization
Address
City/State/Zip
Phone Fax
Presentation Category
Presentation Title
Please provide a 75-100 word description of presentation
topic
For more information, contact
David Bergman, Technical Director
IPC
2215 Sanders Road
Northbrook, IL 60062
tel 847/509-9700 (x340)
fax 847/509-9798
e-mail: [log in to unmask]
SUGGESTED TOPICS
FOR SESSIONS/PAPERS
Advanced Packaging
Ball Grid Arrays
Hi-Density Packaging
MCM-L
Ultra Fine Pitch
Design
Controlled Impedance
Design for Manufacture (DFM)
Design for Test Issues
High-Speed Digital Design
BGA Routing
Environmental
Design for Environment
Compliance Programs
Design for TAKEBACK
Flex Circuits
Fine Pitch Flex
Adhesives Flex
Electroless Plating of Flex
Materials
Photoimageable Dielectrics
Environmentally Friendly Materials
Advances in Laminates, Prepregs and other materials
PC Board Fabrication
Direct Imaging
Hole Formation Advances
Hot-Air Leveling (HASL)
MCM-L Fabrication
Protective Coatings (OSPs)
Ultra Fine Pitch
PCMCIA
Assembly Technology
Controlled Atmosphere Soldering
BGA Reflow
Laser Soldering
New Soldering Materials/Processes
Test and Inspection
Bare Board Test
Boundary Scan
Environmental Stress Screening
Plating Technology
Direct Metallization
Surface Finishes
Quality and Reliability
Continued Process Improvement
Field Reliability
Rework and Repair
Solder Joint Reliability
International Specification Activity
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