Address,

Has anyone encountered incompatibility issues with OSPs and No clean 
fluxes used in Dual wave solder units.  We are having difficulties in 
solder wicking into some of the barrels, used and non-used through 
holes.  I have found some orange/amber debris on the board surface 
after wave.  I assume it is the flux, since it has this color to begin with.  
I don't think it is the OSP, since it measures between 3microinches or 
.1 angstroms.  The board is 8x17, through hole technology only (NO SMTs).  
The boards are shipped from Japan.  No apparent oxidation is seen prior 
to wave.  The boards are cleaned in a Corpane unit using Axarel.

Will someone please advise.  Thank you.

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