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1996

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Mon, 23 Dec 1996 14:18:40 -0500
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I doubt you could screen Ablebond 163-4 . Check with them but I don't think
the rheology is correct. 
Basically you need a thixotropic and cohesive material. SMT adhesive or a
silver conductive material as used for solder replaement would most likely
do. If you screen/stencil this rather like in intrusive paste reflow it
should wet into the hole and cure there. Adjust screen/stencil thick to give
appropriate volume, which you can caluclate easily enough (Pi r squared and
all that stuff).
Check compatibility of surfaces as well whilst speaking with Ablestik - most
epoxy materials don't bond very well to tin or tin containing surfaces (eg
solder).
As, if not more, importantly 163-4  work life is only around 45 minutes, this
does not give you very long to set up and print before you will have to
remove the material and junk it.
I guess the idea is that it is a cheap(compared to silver filled) conductive
material, but unless you print an awful lot of assemblies very rapidly you
will loose any price economies in material wastage and clean up time. You
might consider dispense as you could pick a syringe size to keep within the
limited work life. 

Mike Fenner
BSP (UK)
Tel: +441 295 720631
Fax::+441 295 720 937

------------------------------------------------------------------------------
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From: [log in to unmask]
Message-Id: <[log in to unmask]>
Subject: via hole filling with epoxy (ablebond)

does anyone have any information on how to apply Ablebond 163-4n 
copper filled epoxy into via holes by means of screening or stencil? 
this is the liquid epoxy type. need any suggestions or info i can 
get. thank you.

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