WHAT YOU DESCRIBE WE WOULD CALL "DRY PACKING".
     
     IT IS A COMMON PRACTICE FOR THOSE SMT COMPONENTS WHICH HAVE CERTAIN 
     CRITICAL DESIGN VALUES SUCH AS PACKAGE SIZE, DIE SIZE, PACKAGE 
     THICKNESS, ETC.
     
     IF YOU RECHECK I THINK YOU WILL FIND THE BAKE TEMP. IS 125 DEGC. NOT 
     DEGF.


______________________________ Reply Separator _________________________________
Subject: Handling of SMT components
Author:  [log in to unmask] at smtp
Date:    9/11/96 02:22 PM


We recently received some SMT components in vaccuum sealed packaging, which 
included dessiccant packets, with warnings about exposure to moisture. If 
the ICs were to be stored above 68% RH or if the bag was opened, the parts 
were to be used within 2 or 7 days. If they were not used within that time 
period they have to go thru a 24 hour cure at 125F. These are fairly simple 
J lead and gull wing packs ( one of them is an LGA), but we have not seen 
this warning on other SMT ICs. Is this fairly standard?       Tom Moore
Tom Moore
     
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