WHAT YOU DESCRIBE WE WOULD CALL "DRY PACKING". IT IS A COMMON PRACTICE FOR THOSE SMT COMPONENTS WHICH HAVE CERTAIN CRITICAL DESIGN VALUES SUCH AS PACKAGE SIZE, DIE SIZE, PACKAGE THICKNESS, ETC. IF YOU RECHECK I THINK YOU WILL FIND THE BAKE TEMP. IS 125 DEGC. NOT DEGF. ______________________________ Reply Separator _________________________________ Subject: Handling of SMT components Author: [log in to unmask] at smtp Date: 9/11/96 02:22 PM We recently received some SMT components in vaccuum sealed packaging, which included dessiccant packets, with warnings about exposure to moisture. If the ICs were to be stored above 68% RH or if the bag was opened, the parts were to be used within 2 or 7 days. If they were not used within that time period they have to go thru a 24 hour cure at 125F. These are fairly simple J lead and gull wing packs ( one of them is an LGA), but we have not seen this warning on other SMT ICs. Is this fairly standard? Tom Moore Tom Moore *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * *************************************************************************** *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************