TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Stew Benedict <[log in to unmask]>
Date:
Fri, 6 Dec 1996 05:24:35 -0500 (EST)
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (25 lines)

  We've been wave-soldering MELF and SOD80/SOD87 pkgs in large qty's
for about 5 years now.  We've had little problem with alignment, using
square pads.  The biggest problem we've had is bridging - mostly due
to board density being much higher than ideal.  (By large qty, I mean
over 1 million units/yr, with about 8 diodes per unit)

Stew Benedict, CAD Specialist, GE Lighting, Cleveland OH
[log in to unmask]




***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************



ATOM RSS1 RSS2