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Date: | Wed, 24 Jul 1996 07:20:48 -0400 |
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cycles.
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I would be most interested in any publications or experiences about
component degradation resulting from thru-hole components being
exposed to reflow temperatures after placing SMT parts. The natural
flow of an assembly line would be to place SMT components and then
insert thru-hole components. However, as a subcontractor, layout
designs don't always conform to manufacturability standards and due to
interference from bottom side SMT parts conflicting with insertion
machine anvils, being able to insert thru-hole parts, especially dips, and
then place bottom side SMT devices would be considerable.
I would also be interested in reviewing other methods about building
such layout designs without increasing hand placement labor.
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