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Date: | Wed, 28 Feb 1996 13:30 -0500 (EST) |
Content-Type: | MULTIPART/MIXED |
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Thanks for your time and assistance. It is greatly appreciated!
Regards,
Kevin Frasier
Scientific Atlanta
Atlanta, GA
http://www.sciatl.com
______________________________ Reply Separator _________________________________
Subject: FW: Stencil Printing Adhesive (for bottom side SMT)
Author: [log in to unmask] at PMDF
Date: 2/28/96 10:51 AM
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From: Yuen, Michael
To: 'Technet'
Subject: FW: Stencil Printing Adhesive (for bottom side SMT)
Date: Wednesday, February 28, 1996 8:20AM
Priority: High
Yes. I have had some success in the past working with a lactate adhesive.
Major problem Included clean up and curing in the stencil apertures. Since
January I have been working with MPM Corp. They have done a lot of work and
research into printing adhesives. I feel they have solved the major problems
I experienced with adhesives. Currently I am starting on some new adhesive
process. The material I will be using is from Grace Specialty Polymers
called Amicon D 125 f 5. Printer parameters are similar to that of printing
paste.
Rosenthal, Ed
Process Engineer
EAC
[log in to unmask]
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From: TechNet-request
To: TechNet
Subject: Stencil Printing Adhesive (for bottom side SMT)
Date: Tuesday, February 27, 1996 3:14PM
To Whom It May Concern:
Has anyone had any experience stencil printing adhesive for bottom side
chip components in a medium to high volume facility? We are looking at
some very large quantities of chip components on the bottom side of the
boards and the present dispensing equipment will not be able to keep up
with the component placement rate.
If so: what is a recommended adhesive formulation?
what are some recommended squeegee print speed and pressures?
what are associated areas of risk stencil printing adhesive?
Thank you for your time and consideration.
Regards,
Kevin Frasier
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Date: Wed, 28 Feb 1996 09:51:00 -0600 (CST)
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From: "Yuen, Mike" <[log in to unmask]>
Subject: FW: Stencil Printing Adhesive (for bottom side SMT)
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